Industrial Automation Systems
Multi-wire Electrical Discharge Slicing Technology
Electric blades that can cut through extremely hard materials contribute to increasing SiC slicing productivity.
| R&D category | Industry |
|---|---|
| Purpose, feature or effect of the R&D | High-Precision, Cutting Costs |
Overview
Mitsubishi Electric has developed a prototype wire electrical discharge machining technology that can slice an SiC ingot into 40 pieces at once.
This development is expected to increase SiC slicing productivity and promote the effective use of SiC materials.
Technology Point
World-leading* wire EDM machine with 40 parallel wires
Forty wire electrodes with a diameter of 0.1 mm aligned at 0.6mm intervals wind to cut 40 slices at once.
Development of a dedicated power supply for SiC slicing
A high-frequency power supply dedicated to SiC slicing supplies uniform energy to 40 power feed contacts simultaneously. The wire electrodes are a mere 0.1mm in diameter, but ensure uninterrupted processing without wire breakage.
- * As of Feb. 6, 2013 according to an internal survey
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